Tumbler 10E Ultra-Mini Embedded RFID Tag

Ultra-mini 5 × 5 × 3 mm ceramic UHF RFID tag for source installation in compact components, tools and metal assets. Designed for controlled cavities where minimal footprint and a flush, protected installation are critical.

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WHY TUMBLER 10E

The smallest starting point for source-installed RFID

Tumbler 10E adapts the 5 × 5 × 3 mm Tumbler ceramic platform for embedded integration in compact tools, components and equipment. Its ultra-small footprint supports cavities where external tags would add unwanted profile or remain exposed to handling damage.

5 × 5 × 3 mmUltra-mini ceramic footprint
Source-installedIntegrated during production
Flush / recessedReduced exposed edges
UHF RFIDLong-range automated identification
SOURCE INTEGRATION

Make the RFID identity part of the asset

Install the tag in a controlled cavity, groove or molded feature during component or equipment production. A flush or recessed installation reduces exposed edges and can reduce direct impact and abrasion exposure and make unintended removal more difficult. Vibration resistance depends on retention and the complete assembly; no tested mechanical grade is implied.

  • Define cavity geometry and tag orientation in the product drawing
  • Qualify a compatible retention or potting process for the tag and host asset
  • Control installation depth and surrounding material in production
  • Encode and verify the tag as part of manufacturing quality control
RF DESIGN NOTE

The host asset becomes part of the RF system

Embedding depth, nearby metal, cavity dimensions, resin or molding material and reader orientation can change performance. Final read range is an installed-system result, not a stand-alone tag guarantee.

  • Confirm ETSI or FCC frequency region
  • Prototype on the real asset material and geometry
  • Validate the intended reader, antenna, distance and orientation
  • Lock the approved installation in the BOM and work instruction
TECHNICAL SPECIFICATIONS

Tumbler 10E specifications

Mechanical
RFID coreCeramic
Size5 × 5 × 3 mm
IntegrationCavity / groove / potting
Surface profileFlush or recessed by design
RF
Frequency866–868 MHz / 902–928 MHz
ProtocolEPCglobal Class 1 Gen 2 / ISO 18000-6C
ChipAlien Higgs-3
Memory96-bit EPC / 512-bit user memory
Read rangeValidate in final embedded geometry
Installed assembly
InstallationEmbedded / recessed
RetentionApplication-defined
RF validationRequired on final asset
Environmental ratingDepends on final assembly

Dimensions and component-level data are starting points for engineering selection. The final assembly must be validated for RF performance, retention, ingress, chemicals, shock, vibration and temperature where these are acceptance criteria.

BEST-FIT APPLICATIONS

Where Tumbler 10E fits best

Precision Tools
Small Metal Components
Fixtures & Jigs
OEM Modules
WIP Parts
Application validation
APPLICATION VALIDATION

Qualify the installed RFID system before production release

Use representative production assets and the intended reader setup. Small changes in cavity depth, metal geometry, resin and orientation can materially change RF performance.

Asset drawing and cavity
Metal / polymer geometry
Embedding depth
Potting or molding material
Reader and antenna
Required read zone
DESIGN-IN & PRODUCTION

Embedding & Installation Requirements

Tag dimensions are not hole or cavity dimensions. Release the installation drawing and process only after samples have been qualified on the intended asset.

Cavity & depth

Confirm cavity length, width or diameter, depth, clearance, tolerances and the surrounding metal geometry. Specify the final position relative to the asset surface. Request an approved drawing before machining; no universal hole size is specified.

Orientation & retention

Confirm tag face direction and installation angle against the reader and antenna arrangement. Use a fixture to hold the approved position. Qualify retention for the expected loads; do not assume an interference fit is suitable for a ceramic core.

Potting & cure process

Approve the adhesive or potting material for RF compatibility, adhesion, service temperature, chemicals and thermal expansion. Define surface preparation, mix ratio, dispensing, void control and the supplier’s cure schedule. No universal resin grade or cure setting is specified.

Verify after final assembly

Check RFID encoding and read performance after the approved cure is complete. Qualify retention, ingress, impact, vibration and temperature on representative assemblies where required. Revalidate changes to the cavity, angle, potting material or process.

Request an installation drawing and sample validation plan · Compare Embedded RFID Tags

PRODUCT ENQUIRY

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    Tumbler 10E Ultra-Mini Embedded RFID Tag
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